Here, the process steps involve first creating the RDL on a carrier wafer, chipattaching the topdie (CoW), molding singulation. In either case, generating the RDL requires expensive fab/foundry (BEOL) class equipment that may not be readiy available at …
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Get PriceMar 20, 2019· EV Group (EVG), a supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry’s first process technology platform for waferlevel heterogeneous integration of gallium arsenide (GaAs) on silicon for …
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Get PriceFounded in 1980, EV Group (EVG) is a global supplier of wafer bonders, aligners, thin wafer temporary bonding and debondingequipment, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology and medical device markets.
Get PriceEV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has unveiled its nextgeneration laser debonding solution, which enables highthroughput, lowcostofownership (CoO) roomtemperature debonding for ultrathin and stacked fanout packages.
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Get PriceEquipment Manufacturers International (EMI) is the leading US manufacturer of foundry equipment offering a full range of green sand molding solutions. From molding and auxiliary equipment to complete stateoftheart turnkey molding lines, EMI brings innovation and experience to the design, manufacturing, and installation of each project.
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Get PriceDismantling automotive or mechanical equipment, not including debonding brake or clutch components. Medium impact industry. Metal foundry producing less than 10 tonnes of metal castings per annum; Boiler making or engineering works producing less than 10 000 tonnes of metal product per annum;
Get PriceThe temporary bonding and debonding equipment uses a hybrid laser debonding solution with an throughput of over 60 to 100 wafers per hour. It also supports wafer thinning to less than a human hair thickness (less than 50 microns) for either 200mm or 300mm wafers.
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